印度半导体2.0申请门户上线：127500亿卢比投入，电子元件计划12家申请者同日获批公布
印度联邦部长瓦什纳夫（Ashwini Vaishnaw）11月6日在「印度半导体计划」下开通「半导体2.0」（Semicon 2.0）网络申请门户，同场公布电子元件制造计划（ECMS）首批12家获批申请者。门户首批开放半导体2.0六大支柱中的第2、3、4支柱申请。
半导体2.0的六大支柱为：芯片设计、设备与材料、增设晶圆厂、强化先进封装与测试（ATMP/OSAT）、研发与人才培养。印度联邦内阁已批准该计划在「印度半导体使命」下投入127500亿卢比。此前的半导体计划一期已批准6个邦的12个项目，累计投资逾164000亿卢比，其中5个项目已在2026年10月前投产。
在设计能力方面，「从芯片到初创」计划已让332家机构用上电子设计自动化工具，约7万名学生受训。印度政府希望以门户一站式申请加快本土半导体生态建设。
（来源：印度新闻信息局）
India Launches Semicon 2.0 Application Portal: 127,500 Crore Rupee Push, 12 Electronics Components Applicants Announced
Union Minister Ashwini Vaishnaw launched the Semicon 2.0 Web Application Portal on November 6 under the Semicon India Programme, and announced 12 approved applicants under the Electronics Components Manufacturing Scheme (ECMS) on the same occasion. The portal initially opened applications for Pillars 2, 3 and 4 of Semicon 2.0.
The six strategic pillars of Semicon 2.0 are chip design, machines and materials, setting up more fabrication facilities, strengthening the ATMP and OSAT industry, research and development, and talent development. The Union Cabinet has approved an outlay of 127,500 crore rupees for the programme under the India Semiconductor Mission. The earlier phase of the Semicon India Programme approved 12 projects across six states involving cumulative investment of more than 164,000 crore rupees, five of which had commenced commercial production by October 2026.
On design capability, the Chips to Startup initiative has given 332 institutions access to electronic design automation tools and trained approximately 70,000 students. The government hopes the single portal will speed up building a domestic semiconductor ecosystem.
(Source: Press Information Bureau, India)
来源：印度新闻信息局
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