苏姿丰首尔行：MI455与Helios系统已开始出货 与三星、SK海力士展开多代HBM合作
10月7日，AMD首席执行官苏姿丰在首尔出席AMD Gamer Day活动时表示，公司新一代MI455加速芯片与Helios机架系统已经开始出货，两者均采用HBM4高带宽内存。她透露，AMD与三星电子、SK海力士在HBM上的合作「不限于一代」，将跨多个产品世代延续。
苏姿丰当天与SK海力士首席执行官郭鲁正会面，并计划与三星方面会谈。她还宣布，AMD将在韩国设立人工智能卓越中心（AI Center of Excellence）。谈及供应链投入，她表示AMD将在全球供应链投入「数百亿美元」，但未给出韩国单独的数字。
此前一天（10月6日），苏姿丰在台北与鸿海等供应链伙伴会面，讨论先进制程产能与出货安排。AMD市值近期首次突破1万亿美元。（GSM 据路透社及韩国媒体报道）
关联：
苏姿丰OCP峰会定调「推理之年」：2030年CPU市场将超2000亿美元 Helios已量产出货
Lisa Su in Seoul: MI455 and Helios Systems Now Shipping; Multi-Generation HBM Ties with Samsung, SK hynix
Speaking at AMD Gamer Day in Seoul on October 7, AMD CEO Lisa Su said the company's next-generation MI455 accelerators and Helios rack systems have begun shipping, both using HBM4 memory. AMD's HBM cooperation with Samsung Electronics and SK hynix, she said, is "not limited to one generation" and will continue across multiple product generations.
Su met SK hynix CEO Kwak Noh-jung the same day and planned talks with Samsung. She also announced that AMD will establish an AI Center of Excellence in South Korea. On supply-chain spending, she said AMD will invest "tens of billions of dollars" globally, without giving a Korea-specific figure.
A day earlier, on October 6, Su was in Taipei meeting supply-chain partners including Foxconn on advanced-process capacity and shipments. AMD's market value recently passed $1 trillion for the first time. (GSM, based on Reuters and Korean media reports)
Related:
AMD's Lisa Su in Taipei: SI Chip Demand Outpacing Supply for Years
At OCP Summit, Lisa Su Declares the 'Year of Inference'; CPU Market to Top $200B by 2030
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图片来源：图：AMD首席执行官苏姿丰（2024年资料照片）。图片来源：Wikimedia Commons（CC BY 4.0）。Photo: AMD CEO Lisa Su (2024 file photo). Source: Wikimedia Commons (CC BY 4.0).
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