佳能 12 月初开售 FPA-6400ES6a 光刻机：氟化氪扫描式，每小时处理 400 片 300 毫米晶圆
佳能公司 11 月 10 日宣布，将于 12 月初开售 FPA-6400ES6a。这是一款氟化氪扫描式半导体光刻设备，面向存储与逻辑半导体制造。
佳能在发布中称，在每片晶圆 96 次曝光的指定条件下，FPA-6400ES6a 每小时可处理最高 400 片 300 毫米晶圆。
佳能还称，按公司截至 2026 年 11 月 9 日的调研，该机型在面向 300 毫米晶圆的氟化氪扫描设备中具备业界领先的套刻精度。
发布未公布售价、确切开售日期与出货量安排。
氟化氪光源波长为 248 纳米，属于深紫外光刻范畴。佳能此前同系列机型 FPA-6300ES6a 的处理能力为每小时 200 片以上，本次新机型的标称产能为其约两倍。
Canon to Sell FPA-6400ES6a KrF Scanner From Early December: 400 Wafers Per Hour for 300mm Wafers
Canon said on November 10 that it will launch the FPA-6400ES6a in early December 2026. The machine is a krypton fluoride scanning lithography system for manufacturing memory and logic semiconductors.
Under specified conditions of 96 shots per wafer, the FPA-6400ES6a can process up to 400 300mm wafers per hour, according to the company release.
Canon said the machine offers industry-leading overlay accuracy among KrF scanners for 300mm wafers, based on its research as of November 9, 2026.
The release gave no price, exact launch date or shipment volume.
The KrF light source has a wavelength of 248 nanometers and belongs to deep ultraviolet lithography. Canon rated its earlier FPA-6300ES6a series at more than 200 wafers per hour, making the new model rated at about twice that throughput.
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图片来源：图：半导体洁净室内精密设备正在加工一片硅晶圆。ResearchFrontier 摄，CC BY 4.0，经 Wikimedia Commons / Photo: Precision Wafer Processing in a Cleanroom. By ResearchFrontier, CC BY 4.0, via Wikimedia Commons
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