台积电 Phoenix 第二工厂完工：3纳米量产提前至2027年第三季
位于亚利桑那州马里科帕县的 Phoenix 市，台积电（TSMC）亚利桑那项目再传里程碑。公司董事长兼首席执行官魏哲家在10月15日的第三季度财报电话会上宣布，位于北 Phoenix 的第二座晶圆厂已完成建设，正进入设备搬入与安装阶段，量产时间将提前至2027年第三季，早于原定计划，第二座工厂将生产3纳米芯片。
台积电在亚利桑那的总投资达2650亿美元，是美国历史上最大的外国直接投资之一。第一座工厂自2024年起以4纳米工艺生产芯片；第三座2纳米工厂正在建设中，预计本十年末全面投产，第四座工厂与首座先进封装厂也已动工。
受超级智能（SI）芯片需求推动，台积电第三季营收467.2亿美元，同比增长41.2%，公司维持2026年600亿至640亿美元的资本支出预算。魏哲家还表示，公司正在评估包括德克萨斯州在内的更多美国扩产机会，但尚未做出最终决定。（GSM 据台积电财报电话会及 AZ Big Media 报道）
TSMC Completes Second Phoenix Fab: 3nm Production Moved Up to Third Quarter of 2027
TSMC's Arizona project in Phoenix, Maricopa County, Arizona, has reached another milestone. During the company's third-quarter earnings call on October 15, Chairman and CEO C.C. Wei announced that construction of the second fab in North Phoenix is complete and the plant is moving into tool move-in and installation, with volume production of 3-nanometer chips moved up to the third quarter of 2027, slightly ahead of the previous schedule.
TSMC's total investment in Arizona stands at $265 billion, one of the largest foreign direct investments in US history. Its first fab has been producing 4-nanometer chips since 2024; a third, 2-nanometer fab is under construction and expected to be fully operational before the end of the decade, and early work has begun on a fourth fab and the first advanced packaging facility.
Driven by demand for SI chips, TSMC reported third-quarter revenue of $46.72 billion, up 41.2% year over year, and reaffirmed its 2026 capital spending budget of $60 billion to $64 billion. Wei said the company is evaluating additional US expansion opportunities, including Texas, though no final decisions have been made. (GSM, via TSMC's earnings call and AZ Big Media)
来源：GSM·美国（原文链接）
图片来源：台积电 Phoenix 厂区建设资料图（2023年11月摄）。摄影：Hunter Trick，CC BY-SA 4.0，经 Wikimedia Commons。Photo: TSMC Phoenix campus under construction in November 2023 (file photo), by Hunter Trick, CC BY-SA 4.0, via Wikimedia Commons.
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