壁仞科技配售1.3亿股新H股募资约40亿港元 新一代产品进入流片后验证阶段
10月8日，国产通用GPU厂商壁仞科技（06082.HK）发布公告，已与配售代理中金公司、瑞银集团订立配售协议，拟按每股31.08港元的价格配售1.3亿股新H股，较10月7日收市价34.44港元折让约9.76%，预计募资总额约40.4亿港元、净额约40.2亿港元。
公司表示，所得款项约70%将用于新一代产品的战略供应链采购、生产准备及商业化，约20%用于提升研发能力与软件生态，约10%用于营运资金及一般公司用途。公告同时披露，其新一代产品已完成启动测试并进入流片后验证阶段，进度快于上次配售时的预期，公司正与客户接洽部署，预计未来数个季度内送样并量产。
壁仞科技由张文于2019年创办，2026年1月2日在香港联交所上市；今年7月公司曾完成一轮配售，募资净额约70.4亿港元。配售消息公布后，壁仞科技股价10月9日下跌11.85%，收报30.36港元。（GSM 据公司公告及中国经济网报道）
Biren Technology Raises About HK$4.04B in Share Placement; Next-Gen Chip in Post-Silicon Validation
Chinese GPGPU maker Biren Technology (06082.HK) announced on October 8 that it had signed a placement agreement with agents CICC and UBS to issue 130 million new H shares at HK$31.08 each — a discount of about 9.76% to the October 7 close of HK$34.44 — raising roughly HK$4.04 billion gross and about HK$4.02 billion net.
The company said about 70% of proceeds will fund strategic supply-chain procurement, production readiness and commercialization for its next-generation products; about 20% will go to R&D and its software ecosystem; and about 10% to working capital and general corporate purposes. The announcement also said the next-generation product has completed bring-up testing and entered post-silicon validation, ahead of the schedule expected at the last placement, with customer sampling and mass production planned over the coming quarters.
Biren was founded by Zhang Wen in 2019 and listed in Hong Kong on January 2, 2026; a July placement raised about HK$7.04 billion net. After the new placement was announced, Biren shares fell 11.85% on October 9 to close at HK$30.36. (GSM, based on the company announcement and China Economic Net)
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图片来源：图：香港交易所大楼。图片来源：Wikimedia Commons（CC BY-SA 4.0）。Photo: The Hong Kong Stock Exchange building. Source: Wikimedia Commons (CC BY-SA 4.0).
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