移远通信 SP900BF-AP 智能模组端侧算力达 100 TOPS：基于高通 Dragonwing IQ-9075、工程样品已供选定客户
德国慕尼黑 — 移远通信（Quectel Wireless Solutions）2026 年 11 月 11 日经 BusinessWire 发布智能模组 SP900BF-AP。公司表示，该模组让机器人、检测系统与边缘网关能在设备本身运行大型人工智能模型。
该模组基于高通 Dragonwing IQ-9075 处理器，端侧人工智能算力最高达 100 TOPS。公司表示，把高级人工智能直接集成进产品，可减少与云端处理相关的时延、带宽成本与数据隐私风险。
硬件构成方面，该模组把最高主频 2.36 吉赫的八核高通 Kryo 中央处理器与 Adreno 663 图形处理器、Hexagon 数字信号处理器及专用神经处理单元组合在一起，提供端侧人工智能处理能力。
供货进度方面，SP900BF-AP 已完成关键技术验证，工程样品现已提供给选定客户，用于方案评估与联合开发。移远通信在慕尼黑 electronica 展会 C2.601 展位展示该模组及其端到端物联网方案组合。发布未给出定价与量产时间。本稿数字均以移远通信 11 月 11 日发布正文为准。
Quectel SP900BF-AP Smart Module Delivers up to 100 TOPS of On-Device AI Compute: Built on the Qualcomm Dragonwing IQ-9075, Engineering Samples Now with Selected Customers
Munich, Germany — Quectel Wireless Solutions announced the SP900BF-AP smart module via BusinessWire on November 11, 2026. The company said the module lets robots, inspection systems and edge gateways run large AI models on the device itself.
Built on the Qualcomm Dragonwing IQ-9075 processor, the module delivers up to 100 TOPS of on-device AI compute. Quectel said integrating advanced AI directly into products reduces latency, bandwidth costs and data privacy risks associated with cloud-based processing.
The module combines an octa-core Qualcomm Kryo CPU running at up to 2.36 gigahertz with an Adreno 663 GPU, a Hexagon DSP and a dedicated NPU for on-device AI processing.
The SP900BF-AP has completed key technical validation, and engineering samples are now available to selected customers for solution evaluation and joint development. Quectel is showing the module and its wider end-to-end IoT portfolio on stand C2.601 at electronica in Munich. The release gave no pricing or mass-production date. All figures in this report follow the text of the Quectel release dated November 11, 2026.
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