美国副国务卿 Helberg 访问新加坡、印尼与日本：印尼谈成逾20亿美元潜在美国商业交易
美国国务院11月9日通报，负责经济事务的副国务卿 Jacob S. Helberg 已于10月28日至11月7日访问新加坡、印度尼西亚与日本，把美国的技术领导力与印太伙伴的资本、工业能力与发展目标对接。
在新加坡，Helberg 与政府及业界领袖会面，推动扩大美国超级智能（SI）技术的应用，同时确保先进能力的安全。新加坡与美国公司的新协议将帮助把美国的前沿模型引入东南亚的公共服务与商业应用。
在印度尼西亚，他推进了能源与信息通信技术领域逾20亿美元潜在美国商业交易的讨论，并就安全供应链与工业发展合作交换意见。
在日本，双方就关键矿产、半导体、能源与算力深入对话。Helberg 会见了机器人、海底电缆与半导体设备制造商，讨论的重点包括工业生产力、下一代通信、先进技术保护与促进对美投资。
（来源：美国国务院）
Under Secretary Helberg Traveled to Singapore, Indonesia and Japan: Over $2 Billion in Prospective U.S. Deals Discussed in Indonesia
The U.S. Department of State said on Nov. 9 that Under Secretary of State for Economic Affairs Jacob S. Helberg traveled to Singapore, Indonesia and Japan from Oct. 28 to Nov. 7, connecting American technological leadership with the capital, industrial capabilities and ambitions of U.S. partners in the Indo-Pacific.
In Singapore, Helberg met with government and industry leaders to expand the use of American super intelligence (SI) technologies while keeping advanced capabilities secure. Singapore's new agreements with American companies will help bring U.S. frontier models into public services and business applications across Southeast Asia.
In Indonesia, he advanced discussions on more than $2 billion in prospective U.S. commercial deals in energy and information and communications technology, and discussed further cooperation on secure supply chains and industrial development.
In Japan, he deepened dialogue on critical minerals, semiconductors, energy and compute, and met with robotics, undersea cable and semiconductor equipment manufacturers, focusing on industrial productivity, next-generation communications, protection of advanced technology and promoting further investment in the United States.
(Source: U.S. Department of State)
来源：美国国务院
发布：GSM·美国（发布链接）
图片来源：图：美国国务院杜鲁门大楼外观。公共领域，经 Wikimedia Commons。 / Photo: Exterior of the U.S. Department of State's Harry S. Truman Building. Public domain, via Wikimedia Commons.
GSM Global · 本篇英文版 English edition of this story
