意法半导体ST87M01物联网模组新增三大能力：Onomondo软件SIM、SGP.32工厂内预置与Zephyr支持，11月10日至12日在维也纳Enlit展出
日内瓦，11月5日—意法半导体（STMicroelectronics，纽约证券交易所：STM）宣布为其 ST87M01 窄带物联网（NB-IoT）工业模组的用户提供新的能力选项：集成 Onomondo SoftSIM 软件 SIM、支持基于 SGP.32 标准的工厂内直接预置 SIM 配置文件，以及兼容 Zephyr 开源生态系统。
意法半导体表示，Onomondo SoftSIM 是运行在 ST87M01 处理子系统上的软件方案，使设备不再需要实体 SIM 器件。公司称，这一方案可显著加快物联网设备部署、明显降低生产成本，并减少功耗以减轻电池负担，同时简化设备生命周期与供应链管理。
在工厂预置方面，设备制造商可借助 SGP.32 标准在生产线上直接下载并预置移动网络运营商的配置文件，无需再为不同运营商备货预配置的 SIM。意法半导体称，同一套 SGP.32 框架可同时用于工厂预置与现场远程配置文件管理，有助于简化库存管理。
意法半导体多细分市场 ASIC 与专用产品事业部总经理 Massimiliano Brambilla 表示，ST87M01 新增的软件连接与 SIM 管理选项进一步扩展了该系列的灵活性，公司同时已把 ST87M01 集成进广泛采用的 Zephyr 框架，使该模组系列进入一个广阔的开源嵌入式生态。ST87M01 的 Zephyr 驱动现已通过 Zephyr 的 GitHub 提供，支持 UDP、TCP、HTTP、MQTT 与 CoAP 等连接功能，以及 GNSS、Wi-Fi 定位与信号强度显示。
产品规格方面，ST87M01 模组系列包含多个型号，符合 SGP.32 安全远程 SIM 预置要求，可选 GSMA 认证的嵌入式 SIM、GNSS／A-GNSS、无线 M-Bus 与 Wi-Fi 定位；模组符合 LTE Cat NB2 Release 15，覆盖全球区域频段，已通过 GCF、欧盟 RED、RED-DA、FCC／ISED、PTCRB、Anatel 与 Icasa 等认证，采用 12.8 毫米×10.6 毫米 LGA 封装，面向空间受限的物联网应用。
展示安排方面，参观者可在 11 月 10 日至 12 日于奥地利维也纳会议中心举行的 Enlit Europe 展会意法半导体 B.b110 展位观看 ST87M01 的 SIM 预置演示；公司还将于 11 月 10 日至 13 日在德国慕尼黑 electronica 2026 展会 C3 展厅 101 号展位展示 ST87M01 及一系列物联网方案。
STMicroelectronics Adds Three Capabilities to ST87M01 IoT Modules: Onomondo SoftSIM, SGP.32 In-Factory Provisioning and Zephyr Support, on Show at Enlit in Vienna on November 10–12
GENEVA, November 5 — STMicroelectronics (NYSE: STM) has announced new capability options for users of its ST87M01 NB-IoT industrial modules: integration of the Onomondo SoftSIM, support for direct in-factory SIM profile provisioning based on the SGP.32 standard, and compatibility with the Zephyr ecosystem.
ST said the Onomondo SoftSIM is a software-based solution running on the ST87M01 processing subsystem, which makes a physical SIM device unnecessary. The company said the solution dramatically accelerates IoT-device deployment, significantly lowers production costs, reduces power consumption to relieve battery demand, and simplifies device-lifecycle and supply-chain management.
On in-factory provisioning, ST said the ST87M01 lets equipment manufacturers perform SIM profile provisioning on the production line under SGP.32, which saves stocking SIMs preconfigured for different operators. Downloading and provisioning operators' profiles directly on the line helps simplify inventory management while providing a consistent approach to both in-factory provisioning and remote profile management in the field, using the same SGP.32 framework.
"The latest software-based connectivity and SIM-management options for ST87M01 further extend the flexibility of this family for innovators to tackle the next generation of IoT applications," said Massimiliano Brambilla, Multisegment ASIC and Application Specific Division general manager at STMicroelectronics. "We have also integrated the ST87M01 with the widely adopted Zephyr framework, which makes this module series accessible within a broad open-source embedded ecosystem for all developers."
The ST87M01 driver for Zephyr is now available through the Zephyr GitHub, ST said. It supports connectivity features including UDP, TCP, HTTP, MQTT and CoAP, as well as GNSS, Wi-Fi positioning and RSSI display.
The ST87M01 family contains multiple variants compliant with SGP.32 for secure remote SIM provisioning, with options including a GSMA-certified embedded SIM, GNSS/A-GNSS, Wireless M-Bus and Wi-Fi positioning. The modules meet LTE Cat NB2 Release 15 with worldwide regional band coverage, are certified under GCF, EU RED, RED-DA, FCC/ISED, PTCRB, Anatel and Icasa, and come in a 12.8mm x 10.6mm LGA package for space-constrained IoT applications.
Visitors to Enlit Europe can see the ST87M01 SIM-provisioning demonstration at ST's booth B.b110 at VIECON, the Vienna Congress & Convention Center, on November 10–12. ST will also present the ST87M01 and a selection of IoT solutions at electronica 2026 in Munich on November 10–13, in Hall C3, booth 101.
来源：意法半导体
发布：GSM·美国（发布链接）
图片来源：图：意法半导体芯片裸片特写（资料照片）。图片来源：Wikimedia Commons（CC BY-SA 4.0）。 / Photo: Close-up of an STMicroelectronics chip die (file photo). Source: Wikimedia Commons (CC BY-SA 4.0).
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