英伟达宣布供应链扩产：基板产能三年内增至2.5倍，11亿美元预付美国测试产能
柏林——英伟达10月21日在柏林GTC大会上宣布了一项供应链扩产计划：与铟磷（IBIDEN）、三星电机（Samsung Electro-Mechanics）、欣兴电子（Unimicron）达成的基板协议，将在三年内使基板产能合计提高至目前的2.5倍；安靠（Amkor）计划到2028年底将先进封装产能提高300%以上；矽品（SPIL）计划到2027年中期将共封装光学引擎产能提高15倍，到2028年底再翻一番；半导体测试总产能预计从2026年到2027年翻一番。
英伟达同时宣布，向京元电子（KYEC）提供11亿美元的产能预留预付款，用于在美国新建测试设施与设备，目标于2027年4月实现大批量生产；向铟磷提供数十亿美元的产能预留预付款，支持其日本大野工厂的扩产，新增产能预计2028年第一季度开始爬坡；欣兴电子的KF基板生产线预计2027年第二季度开始增加产能、2028年中期达到满产；三星电机则以韩国现有产能立即加入英伟达的基板供应链，并在世宗与釜山推进工厂升级与新建；新加坡的扩建测试业务预计2027年2月实现大批量生产。英伟达首席执行官黄仁勋说：“我们正处在人类历史上最大的基础设施建设之中。需求非常旺盛，产能才是瓶颈。”英伟达表示，该计划旨在提高全球供应链的韧性与冗余。需要说明的是，上述产能数字均为公司公告的计划目标，而非已完成的产量或已披露的客户销售额。
（GSM据英伟达公告综合整理）
Nvidia Announces Supply-Chain Expansion: Substrate Capacity to Rise 2.5x in Three Years, $1.1 Billion Reserved for U.S. Testing
BERLIN — Nvidia announced a supply-chain expansion program at its GTC conference in Berlin on October 21: substrate agreements with IBIDEN, Samsung Electro-Mechanics and Unimicron Technology will, in aggregate, drive a 2.5-times increase in capacity over the next three years; Amkor plans to increase advanced packaging capacity by more than 300% by the end of 2028; SPIL is targeting a 15-times expansion of optical-engine capacity for co-packaged optics by mid-2027, with aims for another doubling by the end of 2028; and total semiconductor testing capacity is expected to double from calendar 2026 to 2027.
Nvidia also said it is providing a $1.1 billion capacity reservation advance to KYEC (King Yuan Electronics) to support new U.S. testing facilities and equipment, with high-volume production targeted for April 2027; a multibillion-dollar capacity reservation advance to IBIDEN to support expansion at its Ono Plant in Japan, where additional capacity is expected to begin ramping in the first quarter of 2028; Unimicron's KF substrate line is expected to start adding capacity in the second quarter of 2027 and reach full capacity by mid-2028; Samsung Electro-Mechanics is joining Nvidia's substrate supply chain with immediate capacity from existing operations in South Korea,
alongside planned facility upgrades and new factories in Sejong and Busan; and expanded testing operations in Singapore are expected to begin high-volume production in February 2027. "We are in the midst of the largest infrastructure buildout in human history," CEO Jensen Huang said. "Demand is extraordinary. Capacity is the constraint."
Nvidia said the program is intended to increase resiliency and redundancy across its global supply chain. The capacity figures are plan targets announced by the company, not completed output or disclosed customer sales.
(GSM, from Nvidia's announcement)
来源：GSM·美国（原文链接）
图片来源：图：英伟达位于加州圣克拉拉的总部，资料图。 / NVIDIA headquarters in Santa Clara, California (file photo).
