商务部签四份研发资助意向书：3.89亿美元投向功率半导体与关键材料
美国商务部（Department of Commerce）10月22日在华盛顿宣布，已与四家公司签署意向书，拟依据《芯片与科学法》（CHIPS and Science Act）提供合计最高3.89亿美元的联邦研发资助，投向功率半导体器件、模块与关键材料。公告由商务部下属的国家标准与技术研究院（NIST）发布。
四家公司与资助上限分别为：总部位于华盛顿州的 Helion 最高1.75亿美元，研发用于聚变发电的高压功率半导体与先进能源功率模块，其半导体将为驱动 Helion 聚变发电机的磁体供能、控制并回收能量；位于马萨诸塞州的 Commonwealth Fusion Systems 最高8,500万美元，研发用于射频等离子体加热的半导体、功率电子器件、聚变诊断嵌入式电子器件与抗辐射电子器件；Vertical Semiconductor 最高7,300万美元，推进其垂直氮化镓（GaN）功率半导体，并演示用于全球首个2.5兆瓦超级智能数据中心机架的技术；Sibelco 最高5,600万美元，开发用于晶体生长坩埚、加工玻璃器皿等半导体价值链硬件的超高纯石英下一代提纯与精加工技术。
商务部表示，最终资助落地后，每家公司将开展针对功率半导体器件、模块与材料关键项目的研发；作为资助条件，商务部将在每家公司取得少数、非控股、无投票权的股权，以提高美国纳税人的回报。商务部长 Howard Lutnick 表示，这批投资将加速美国半导体创新、增强国内能源与电力资源；商务部半导体投资与创新执行主任 Bill Frauenhofer 表示，这批 CHIPS 研发资助将支持功率半导体器件与关键材料的突破，加强美国为电网、先进数据中心、国防系统与新兴聚变能源转换和输送电力的能力。
商务部在公告中表示，功率电子是国内电网现代化与关键能源基础设施供电的基础，功率转换性能的提升可带来更高的电力效率、更强的电网稳定性与更低的热损耗；在本国发展这些能力将减少对海外制造的依赖。据路透社报道，这批资助出自国会2022年批准的100亿美元研发基金，商务部近几个月已向半导体企业发放19笔研发资助。
Commerce Signs Letters of Intent for $389 Million in Chip R&D Awards With Four Companies
The U.S. Department of Commerce announced in Washington on October 22 that it has signed letters of intent with four companies to provide up to $389 million in federal research and development awards under the CHIPS and Science Act, aimed at power semiconductor devices, modules and critical materials. The announcement was published by the National Institute of Standards and Technology (NIST), part of the department.
The four companies and their award ceilings are: Washington-based Helion, up to $175 million to develop high-voltage power semiconductors and advanced energy power modules for fusion power generation, whose semiconductors will power, control and harvest energy from the magnets driving its fusion generators; Massachusetts-based Commonwealth Fusion Systems, up to $85 million for semiconductors for radio-frequency plasma heating, power electronics, embedded electronics for fusion diagnostics and radiation-hardened electronics; Vertical Semiconductor, up to $73 million to advance its vertical gallium nitride (GaN) power semiconductors and demonstrate the technology for the world's first 2.5 MW super intelligence data center rack; and Sibelco, up to $56 million to develop next-generation purification and finishing technologies for ultra-high-purity quartz used across the semiconductor value chain.
The department said that under the final awards each company will conduct R&D on critical projects spanning power semiconductor devices, modules and materials, and that as a condition of funding the department will receive a minority, non-controlling and non-voting equity stake in each company, enhancing the return for the U.S. taxpayer. Secretary of Commerce Howard Lutnick said the awards will accelerate American semiconductor innovation to enhance domestic energy and power resources, while Bill Frauenhofer, the department's Executive Director of Semiconductor Investment and Innovation, said the CHIPS R&D awards will support breakthroughs in power semiconductor devices and critical materials and strengthen America's ability to convert and deliver power for the grid, advanced data centers, defense systems and emerging fusion energy.
The department said power electronics is foundational to modernizing the domestic grid and powering critical energy infrastructure, and that developing these capabilities domestically will reduce reliance on overseas manufacturing. According to Reuters, the funding comes from a $10 billion R&D fund approved by Congress in 2022, and the department has awarded 19 R&D grants to semiconductor firms in recent months.
来源：GSM·美国（原文链接）
图片来源：图：12英寸硅晶圆表面（资料图）。2x910 摄，CC BY-SA 4.0，经维基共享资源。Photo: Surface of a 12-inch silicon wafer (file photo). By 2x910, CC BY-SA 4.0, via Wikimedia Commons.
