格芯与台积电签20亿美元协议：AI芯片关键组件2028年起在纽约量产
格芯（GlobalFoundries）10月8日宣布，与台积电达成一项为期五年、价值20亿美元的制造协议，在其位于纽约州马耳他的工厂，为台积电的 CoWoS 先进封装体系生产硅中介层。这种组件垫在处理器与存储芯片下方，负责让两者高速通信，是先进 AI 芯片封装里不大却关键的一环。
格芯表示，马耳他工厂将扩产，成为美国本土首个此类组件的供应来源，产品还包括带嵌入式深沟槽电容的元件。量产爬坡预计 2028 年上半年开始，协议也为今后按需求继续扩产预留了框架。
先进封装已经成为 AI 芯片产能的主要瓶颈之一。格芯 CMOS 业务高级副总裁埃德·卡斯特表示，把这类关键组件放在美国制造，能为客户提供安全、可扩展的供应，并强化半导体供应链。消息公布后，格芯股价盘前一度上涨约 4%。（GSM 据格芯公司公告与路透社报道摘编）
GlobalFoundries to Make TSMC's AI Chip Interposers in New York in $2 Billion Deal
GlobalFoundries said on Oct. 8 it has reached a five-year, $2 billion manufacturing agreement with TSMC to produce silicon interposers at its Malta, New York facility for TSMC's CoWoS advanced packaging ecosystem. The interposer sits beneath processors and memory chips and lets them communicate at high speed, making it a small but critical piece of every advanced AI package.
GlobalFoundries said it will expand capacity at Malta to establish the first U.S.-based source of silicon interposers for advanced packaging, including versions with embedded deep trench capacitors. Volume production is expected to begin ramping in the first half of 2028, and the agreement leaves room to add more capacity if demand keeps growing.
Advanced packaging has become one of the main bottlenecks in AI chip production. Ed Kaste, the company's senior vice president of CMOS business, said building these key components in the U.S. would give customers a secure, scalable supply and strengthen the semiconductor supply chain. GlobalFoundries shares rose about 4% in premarket trading after the announcement. (GSM summary of the GlobalFoundries announcement and Reuters reporting.)
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